Master-slice type semiconductor integrated circuit device

Details Master-slice type semiconductor integrated circuit device Master-slice type semiconductor integrated circuit device

1992-01-30

1994-11-15

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 524, 174261, 257678, 361820, H05K 702, H01L 2944

Patent

active

053654064

ABSTRACT:
A master-slice type semiconductor chip in the form of a PGA package has a plurality of external pins arranged in a plurality of rows. The external pins of at least the outermost row are electrically connected to an input cell on the semiconductor chip, while the external pins of at least the innermost row is connected to an input/output cell provided on the semiconductor chip. With this arrangement, the wires in the package connected to the input/output cell can have smaller lengths than the wires connected to the input cell, so that crosstalk noises produced by output signals can be reduced.

REFERENCES:
patent: 4689441 (1987-08-01), Dick et al.
patent: 4831497 (1989-05-01), Webster et al.

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