Master slice semiconductor device

Details Master slice semiconductor device Master slice semiconductor device

1992-01-13

1993-03-16

LaRoche, Eugene R.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

257773, 257780, 257784, 257786, H01L 2348, H01L 2160

Patent

active

051949318

ABSTRACT:
A bonding pad to be bonded to a lead electrode is formed to have an opening with a substantially square plane shape, and a bonding pad which is not to be bonded to a lead electrode is formed to have an opening with a substantially square plane shape with a notched position in the center. The outer shapes of the electrode pads are varied in accordance with packages which contain semiconductor chip.

REFERENCES:
patent: 4907039 (1990-03-01), Chikaki
patent: 4974052 (1990-11-01), Ichiyama
Gaensslen et al., "High-density contact design", IBM TDB vol. 14, No. 2, Jul./71, p. 570.

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