Mass wave soldering system

Details Mass wave soldering system Mass wave soldering system

1983-12-16

1986-01-28

Godici, Nicholas P.

Metal fusion bonding

Process

Plural joints

228 37, 228262, 118410, 118 58, 427 96, 427 88, H05K 334

Patent

active

045666245

ABSTRACT:
Contact of a soldered board by a soldering oil supplied from within a solder wave takes place immediately following deposition of molten solder onto the board. The oil causes relocation of solder on and/or removal of excess solder from the underside of the board, and any interconnections, component leads and/or component bodies carried thereon before the solder solidifies as shorts, icicles or bridges.

REFERENCES:
patent: 3190527 (1965-06-01), Tardoskegyi
patent: 3500536 (1970-03-01), Goldschmied
patent: 4171761 (1979-10-01), Boldt

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