Mass soldering system providing an oscillating air blast

Metal fusion bonding – Process – Plural joints

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228260, 228 20, 228 37, 118 63, B23K 100, B23K 3102

Patent

active

046643087

ABSTRACT:
A soldering system is described in which a fluid stream is directed onto a solder board substantially immediately following the deposition of molten solder onto the boards. The impinging fluid stream is rapidly oscillated to create a plurality of different angles of impingement of the air on each area of the bottom surface of the circuit board.

REFERENCES:
patent: 3603329 (1971-09-01), White
patent: 3681118 (1972-08-01), Ohama et al.
patent: 3865298 (1975-02-01), Allen et al.
patent: 4083323 (1978-04-01), Rote
patent: 4315042 (1982-02-01), Spigarelli
patent: 4401253 (1983-08-01), O'Rourke

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