Mass soldering system providing a sweeping fluid blast

Details Mass soldering system providing a sweeping fluid blast Mass soldering system providing a sweeping fluid blast

1986-10-23

1987-07-14

Godici, Nicholas P.

Metal fusion bonding

With means to remove, compact, or shape applied flux or filler

By fluid blast or suction

228 37, 118 63, H05K 334

Patent

active

046797203

ABSTRACT:
A soldering system is described in which a fluid stream is directed onto a solder board substantially immediately following the deposition of molten solder onto the boards. The apparatus includes a pair of concentric slotted tubular shells wherein one shell rapidly rotates relative to about the other to create a plurality of different angles of impingement of the air on each area of the bottom surface of the circuit board.

REFERENCES:
patent: 3500536 (1970-03-01), Goldschmied
patent: 3865298 (1975-02-01), Allen et al.
patent: 4401253 (1983-08-01), O'Rourke

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