Mass soldering system and method

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29203B, H05K 330

Patent

active

039733220

ABSTRACT:
Electrical and electronic components loosely mounted in a circuit board with their leads extending through holes in the board are temporarily stabilized in position in the board by treating the board and component leads at least in part with a selected material in liquid state, and hardening the material to form a solid, solder-compatible, non-metallic cement having a melting point below that of solder, coupling the board and leads to one another. The component leads may then be trimmed to finish length, and the components soldered in place. Alternatively the board may be placed in storage for future soldering. The cement is melted and displaced simultaneously with soldering. Preferred as cement are naturally occurring and synthetic waxes having a melting point in the range of about 120-195.degree.F. In a preferred embodiment of the invention compatible flux active agents and/or wetting agents may be intermixed with the liquid material whereby the board and component leads may be fluxed simultaneously with treating to temporarily stabilize the components in the board.

REFERENCES:
patent: 3388465 (1968-06-01), Johnston
patent: 3568295 (1971-03-01), Moran
patent: 3574934 (1971-04-01), DeRose
patent: 3616533 (1971-11-01), Heap et al.
patent: 3680762 (1972-08-01), Kondo
patent: 3704515 (1972-12-01), Nelson
patent: 3780431 (1973-12-01), Feeney

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