Mass soldering system

Details Mass soldering system Mass soldering system

1981-10-30

1983-09-06

Ramsey, Kenneth J.

Metal fusion bonding

Process

With removing or reshaping of filler material or flash after...

228 20, 228 37, 228180R, 228260, H05K 334, B23K 102

Patent

active

044024487

ABSTRACT:
A soldering system is described in which a freshly soldered board is heated substantially immediately following deposition of molten solder onto the board so as to maintain the freshly applied solder in molten condition, and a fluid stream is then directed onto the molten solder. Preferably, but not necessarily, the fluid, which may comprise a gas or mixture of gases, is heated prior to contacting the board. The impinging fluid stream relocates solder on, and/or blasts excess solder from the bottom of the board, and any interconnections, component leads and/or component bodies carried thereon before the solder solidifies as shorts, icicles or bridges. If desired, liquid droplets such as soldering oil may be included in the fluid stream.

REFERENCES:
patent: 3500536 (1970-03-01), Goldschmied
patent: 3605244 (1971-09-01), Osborne et al.
patent: 3705457 (1972-12-01), Tardoskegi
patent: 3726007 (1973-04-01), Keller
patent: 3765591 (1973-10-01), Cook
patent: 3865298 (1975-02-01), Allen et al.
patent: 4083323 (1978-04-01), Rote
Boynton, Paper from Proceedings of the First Printed Circuit World Convention, London, England, (Jun. 5-8, 1978) pp. 2.3.1-2.3.13.

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