Metal fusion bonding – Process – Plural joints
Patent
1986-10-10
1989-07-11
Ramsey, Kenneth J.
Metal fusion bonding
Process
Plural joints
228 20, 228125, H05K 334
Patent
active
RE0329827
ABSTRACT:
A soldering system is described in which a fluid stream is directed onto a soldered board substantially immediately following deposition of molten solder onto the board. Preferably, but not necessarily, the fluid, which may comprise a gas or mixture of gases, is heated prior to contacting the board. The impinging fluid stream relocates solder on, and/or blasts excess solder from the bottom of the board, and any interconnections, component leads and/or component bodies carried thereon before the solder solidifies as shorts, icicles or bridges. If desired, liquid droplets such as soldering oil may be included in the fluid stream.
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Donovan, IBM Technical Disclosure Bulletin, vol. 5, No. 4, Sep. 1962, pp. 19-20.
Hollis Automation, Inc.
Ramsey Kenneth J.
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