Mass soldering control system

Details Mass soldering control system Mass soldering control system

1978-02-27

1979-12-25

Husar, Francis S.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228 9, 228103, 228180R, 340201R, H05K 334, B23K 300

Patent

active

041801997

ABSTRACT:
A system for measuring time/temperature profiles of a mass soldering operation is described. In accordance with the invention a data probe and miniature transmitter is carried through the soldering operation on top of the circuit board being soldered. A plurality of probes are attached to various components, component leads and selected board areas and provide electrical signals in response to the temperature and dwell time the components and board are subjected to during preheating and soldering. The temperature of the solder at the point the solder contacts the board may also be detected. The electrical signals are wireless transmitted, e.g. by means of low frequency electromagnetic transmission, to a remote stationary receiver for integration and display.

REFERENCES:
patent: 3482755 (1969-12-01), Raciti
patent: 3651405 (1972-03-01), Whitney et al.

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