Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Having light transmissive window
Reexamination Certificate
2001-02-09
2003-09-30
Zarabian, Amir (Department: 2822)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Having light transmissive window
C438S024000, C438S118000, C257S696000
Reexamination Certificate
active
06627482
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of Invention
This patent application is copending with U.S. patent application Ser. No. 09/731,223. This invention relates to optical semiconductor device package, particularly to packages with focusing cups. The semiconductor device may be a light emitting device such as diode, a laser diode, . . . etc. The semiconductor diode may also be a light absorbing device such an image sensor, photo diode . . . etc.
2. Brief Description of Related Art
FIGS. 1-5
show a prior art technique of fabricating a diode package with a focusing cup. A metal plate is punched with holes
15
to yield a matrix of frames
13
. Each frame has two metal plates
11
,
12
. The first metal plate
11
has two horizontal ends, the inner end
111
and outer end
112
. The second metal plate
12
has horizontal ends, the inner end
121
and outer end
122
.
In the next step, the metal plates
11
,
12
are partially covered with an insulating material such as glue to form a cup
10
and bottom support
14
as shown in the top view FIG.
2
. The cup is lined with reflecting coating to focus the light emitted from the diode.
Each semi-finished unit has the outer ends of the metal plates
112
and
122
extending outside the cup
10
as tabs. The section view along the section line A-A′ is shown in FIG.
4
. The inner end
121
is mounted with the optical diode, which is wire bonded to the inner end
111
.
The outer end
112
of metal plate
11
and the outer end
122
of metal plate
12
are then folded as shown in
FIG. 5
to form the bottom contacts of the surface mount package.
Such a structure requires a thick support
14
to withstand the bending moment of the outer end
112
of metal plate
11
and outer end
122
of metal plate
12
as described in a copending U.S. patent application Ser. No. 09/731,223, which disclosed a method of using a pre-formed folded frame to reduce the thickness of the package.
SUMMARY OF THE INVENTION
An object of this invention is to provide a method of mass production of the folded frame structure disclosed in copending U.S. patent application Ser. No. 09/731,223. Another object of this invention is to reduce the cost of fabricating an optical diode package with a focusing cup.
These objects are obtained by preforming the folded bottom contacts of surface mount optical diodes on a metallic substrate before the substrate is diced into individual packages. The metallic substrate is cut with vertical parallel slits inside the horizontal edges of the substrate. Lines parallel to the slits are cut between the slits to form two wings for each slit. The two wings are folded to form the bottom contacts for the surface-mount package. Glues are poured into a mold over and under the metal substrate to form focusing cups and bottom support
14
. The metal substrate and the glue are then diced to form individual packages. The diodes are mounted inside the cups and connected to the divided metal leads at the bottoms of the cups.
REFERENCES:
patent: 5177593 (1993-01-01), Abe
patent: 5302849 (1994-04-01), Cavasin
patent: 5357056 (1994-10-01), Nagano
patent: 5618759 (1997-04-01), Boysel
patent: 5747877 (1998-05-01), Wilson
patent: 5937277 (1999-08-01), Matsuda et al.
patent: 5962917 (1999-10-01), Moriyama
patent: 6078099 (2000-06-01), Liu et al.
Chang Bill
Wang Bily
Harvatek Corporation
Lin Patent Agent H. C.
Perkins Pamela
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