Electricity: electrical systems and devices – Electrolytic systems or devices – Solid electrolytic capacitor
Patent
1992-09-25
1994-10-18
Reynolds, Bruce A.
Electricity: electrical systems and devices
Electrolytic systems or devices
Solid electrolytic capacitor
29 2503, H01G 905
Patent
active
053573994
ABSTRACT:
A method of simultaneously forming a multiplicity of surface mountable solid state capacitors is disclosed. The method comprises mounting on a substrate a wafer of powdered solid state capacitor forming metal, sintering the wafer and metal together to fuse the interface between wafer and substrate to each other and convert the wafer into a porous integral mass, dividing the sintered wafer into a multiplicity of mutually spaced sub-units, isolating the interface or boundary between the substrate and sub-units one from the other by a resin infusion or by a dielectric deposition step, causing the sub-units to be converted to capacitors by sequential anodizing and manganizing steps, bonding a cathode plate to the counter electrode components present on the upper surfaces of the sub-units in electrical contact therewith, filling the voids between adjacent sub-units with insulative resin material by injecting same between the plates utilizing the plates as elements of a mold, and after hardening of the resin sawing through the plates and hardened resin to define discrete encapsulated capacitors. The disclosure further teaches solid state capacitors formed by the noted method.
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Proceeding of the 28th Electronics Components Conference, Anaheim Calif., Apr. 1978, pp. 422-426 "A New Tantalum Chip Capacitor" Richard T. Millard & David M. Cheseldine.
AVX Corporation
Basseches Mark T.
Reynolds Bruce A.
Switzer Michael D.
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