Mass memory and method for the manufacture of mass memories

Details Mass memory and method for the manufacture of mass memories Mass memory and method for the manufacture of mass memories

1997-03-03

1999-06-01

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438106, 438107, H01L 2144, H01L 2148, H01L 2150

Patent

active

059083042

ABSTRACT:
The disclosure relates to a mass memory with very large-scale integration as well as to a method for the manufacture of such a memory.

REFERENCES:
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patent: 5235672 (1993-08-01), Carson
patent: 5362986 (1994-11-01), Angiulli et al.
patent: 5397747 (1995-03-01), Angiulli et al.
Chang-Lee Chen, et al., "Bond Wireless Multichip Packaging Technology for High-Speed Circuits", IEEE Transactions On Components, Hybrids, and Manufacturing Technology, vol. 15, No. 4, (1992), pp. 451-456.

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