Maskless process for applying a patterned solder mask coating

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

427 431, 427 541, 427 97, 427273, 427335, 427375, 427379, 4273935, 427 96, 427420, 427421, 427428, B05D 306, B05D 512

Patent

active

044593201

ABSTRACT:
A maskless process is disclosed for applying a patterned solder mask coating to a circuit board (31). In accordance with the process, there is applied to the surface (30) of the circuit board an uncured material (32) having a cure reaction which is susceptible to inhibition by the presence of oxygen. The surface of the circuit board is covered with the material to a first predetermined thickness. This first predetermined thickness of material on land areas (34) surrounding holes (36) in the circuit board is diminished to a second predetermined thickness by allowing a portion of the material on the land areas to flow into the holes. The uncured material is exposed to a first energy source which delivers a quantity of energy such that a surface layer (38) having the second predetermined thickness has its cure reaction substantially inhibited due to the presence of oxygen. Any uncured material in regions having the first predetermined thickness undergoes an advancement in cure reaction in a sublayer (37) beneath the cure-inhibited surface layer. Thereafter the cure-inhibited surface layer is removed from the circuit board with an appropriate solvent. The remaining material may be exposed advantageously to a second energy source to provide a further advancement in its cure reaction.

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