Masking of holes in circuit patterns on circuit boards prior to

Details Masking of holes in circuit patterns on circuit boards prior to Masking of holes in circuit patterns on circuit boards prior to

1985-09-04

1987-01-20

Grimley, Arthur T.

Electricity: conductors and insulators

Conduits, cables or conductors

Single duct conduits

29829, 427 96, 427154, 428901, H05K 100, H05K 300

Patent

active

046381163

ABSTRACT:
A circuit pattern on a circuit board usually has a number of contact areas to which components are soldered. Some of the contact areas have holes extending through the board for insertion of leads of leaded components, the leads then being flow soldered to the contact areas. It often occurs that additional leaded components are to be mounted on the board after a first flow soldering step. However, holes through which the leads are to pass can be closed by solder. These holes are therefore masked mechanically, by a masking member which contacts the board at these holes, or by tape, or other such method. The present invention uses a conventional solder resist layer, usually applied prior to flow soldering, extending the solder resist layer over a part of the contact area to the periphery of the hole, the hole having an unplated bore or wall. The resist layer extends for at least part of the hole periphery. This prevents the solder being attached to the contact area at the masked periphery and the hole is not closed by a film of solder.

REFERENCES:
patent: 3268653 (1966-08-01), McNutt
patent: 3567844 (1971-03-01), Kremar
patent: 3610811 (1971-10-01), O'Keefe
patent: 4301189 (1981-11-01), Arai et al.

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