Masking of circuit boards for wave soldering

Details Masking of circuit boards for wave soldering Masking of circuit boards for wave soldering

1987-06-15

1988-04-26

Godici, Nicholas P.

Metal fusion bonding

Process

Plural joints

228 39, B23K 3102

Patent

active

047399198

ABSTRACT:
A soldering mask for soldering the leads of leaded components to a circuit pattern on a surface of a circuit board also having surface mounted components already soldered to the circuit pattern on that surface, comprises a flat metal plate having a recess in the top surface of the plate for reception of the circuit board. Cavities in the bottom surface of the recess house the surface mounted components. Openings through the plate from the bottom surface of the recess permit passage of leads and also permit access by the solder to solder the leads to the circuit pattern.

REFERENCES:
patent: 4421265 (1983-12-01), Boyer et al.
patent: 4515304 (1985-05-01), Berger
patent: 4678531 (1987-07-01), Metzger et al.

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