Mask, mask chip, manufacturing method of mask, manufacturing...

Details Mask, mask chip, manufacturing method of mask, manufacturing... Mask, mask chip, manufacturing method of mask, manufacturing...

2007-09-11

2007-09-11

Deng, Phuc T. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C438S021000, C216S041000

Reexamination Certificate

active

11425396

ABSTRACT:
A mask in which a plurality of mask chips are connected to one another via a supporting member, includes: a plurality of first opening sections that are provided in the plurality of mask chips and that correspond to a pattern to be formed; a cutout section provided at at least one of side faces opposing to each other of the mask chips adjacent to each other; a gap section provided at a connected section connecting the mask chips adjacent to each other, the gap section being composed of the cutout section and including a second opening section corresponding to a pattern to be formed; and a block section that is provided at at least one of the mask chips adjacent to each other and that covers the gap section other than the second opening section.

REFERENCES:
patent: 7045904 (2006-05-01), Odegard et al.
patent: 2003/0129788 (2003-07-01), Asano et al.
patent: 10-8239 (1998-01-01), None
patent: 2001-185350 (2001-07-01), None
patent: 2001-273976 (2001-10-01), None
patent: 2003-67454 (2003-03-01), None
patent: 2003-332056 (2003-11-01), None

Affiliated with

Also associated with

Rating

Mask, mask chip, manufacturing method of mask, manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mask, mask chip, manufacturing method of mask, manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mask, mask chip, manufacturing method of mask, manufacturing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3779880