Mask for printing solder paste

Details Mask for printing solder paste Mask for printing solder paste

1995-06-12

1997-01-14

Vo, Peter

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

29840, 101127, B23K 3706, H05K 334

Patent

active

055930808

ABSTRACT:
A mask for printing solder paste includes a mask plate, and first mask holes which are formed in the mask plate and have a first size, and second mask holes which are formed in the mask plate and have a second size smaller than the first size. The mask plate has a first region having the first mask holes, and a second region having the second mask holes. The mask plate has a first thickness in the first region, and a second thickness in the second region. The second thickness is smaller than the first thickness.

REFERENCES:
patent: 2964007 (1960-12-01), Buffington
patent: 3516155 (1970-06-01), Smith
patent: 4311267 (1982-01-01), Lim
patent: 4323593 (1982-04-01), Tsunashima
patent: 4626309 (1986-12-01), Mullen, III et al.
patent: 4694138 (1987-09-01), Oodaira et al.
patent: 4739919 (1988-04-01), Van Den Brekel et al.
patent: 4774760 (1988-10-01), Seaman et al.
patent: 4872261 (1989-10-01), Sanyal et al.
patent: 4953460 (1990-09-01), Wojcik
patent: 5129573 (1992-06-01), Duffey
"Solder Mask" IBM Technical Disclosure Bulletin, vol. 9, No. 3, Aug. 1966, pp. 234-235.

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