Mask controlled coupling of inter-substrate optical components

Details Mask controlled coupling of inter-substrate optical components Mask controlled coupling of inter-substrate optical components

1989-04-28

1990-10-30

Arnold, Bruce Y.

Radiation imagery chemistry: process, composition, or product th

Post imaging processing

Physical developing

35016223, 35016222, 350321, 350452, 350501, 350613, 430321, 437984, 437924, B29D 1100, G02B 700, G02B 308, G02B 508

Patent

active

049664468

ABSTRACT:
Alignment difficulties in optical computing arrangements are overcome by integrating the optical components on a single substrate and arranging the elements in a manner that causes them to interact with one another to perform the desired function. The substrate has one or two major surfaces and the elements are grown or fabricated on those surfaces using conventional integrated circuit manufacturing techniques. Recognizing that an optical circuit can be larger than what can be fabricated on a single substrate, aligning structures are fabricated onto substrates that need to be coupled to form the optical circuit. The aligning structures contain registrable protrusion and indentation portions, such as ridges and grooves, that are imbedded into the substrates as part of the manufacturing process of the optical elements. Most advantageously, the position-sensitive optical devices are manufactured on one side.

REFERENCES:
patent: 3631360 (1971-12-01), Lehovec
patent: 4079404 (1978-03-01), Comerford et al.
Goodman, Joseph W. et al., "Optical Interconnections for VLSI Systems" Proceedings of the IEEE, vol. 72, No. 7, Jul. 1984.
Firester, A. H. et al., "Fabrication of Planar Optical Phase Elements", Optics Communications, vol. 8, No. 2, Jun. 1973.
"Diffractive-Reflective Optical Interconnects" K. Brenner and F. Sauer Applied Optics vol. 27, No. 20, 15 Oct. 1988.

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