Mask blank substrate, mask blank, exposure mask, mask blank...

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

Reexamination Certificate

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C451S008000

Reexamination Certificate

active

07745074

ABSTRACT:
In a mask blank substrate to be chucked by a mask stage of an exposure system, the flatness of a rectangular flatness measurement area excluding an area of 2 mm inward from an outer peripheral end surface on a main surface of the mask blank substrate on its side to be chucked by the mask stage is 0.6 μm or less, and at least three of four corner portions of the flatness measurement area each have a shape that rises toward the outer peripheral side.

REFERENCES:
patent: 6537844 (2003-03-01), Itoh
patent: 6951502 (2005-10-01), Koike et al.
patent: 7455785 (2008-11-01), Koike et al.
patent: 7579120 (2009-08-01), Akagawa
patent: 7592104 (2009-09-01), Tanabe et al.
patent: 2003/0186624 (2003-10-01), Koike et al.
patent: 2004/0137828 (2004-07-01), Takahashi et al.
patent: 2005/0019677 (2005-01-01), Nakatsu et al.
patent: 2005/0019678 (2005-01-01), Nakatsu et al.
patent: 102004035560 (2005-03-01), None
patent: 2003-50458 (2003-02-01), None
German Office Action corresponding to German Patent Application No. 102005046135.2-51, dated Feb. 2, 2010.

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