Mask and substrate alignment for solder bump process

Details Mask and substrate alignment for solder bump process Mask and substrate alignment for solder bump process

2003-06-27

2008-08-12

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Miscellaneous

Reexamination Certificate

active

07410919

ABSTRACT:
A system for of aligning a mask to a substrate comprising: a fixture for holding the mask and the substrate in fixed positions relative to each other; means for holding the substrate, the means for holding the substrate protruding through openings in a table and the fixture, the means for holding fixedly mounted on a stage, the stage moveable in first and second directions and rotatable about an axis relative to the table; means for affixing the fixture containing the mask and the substrate to the table; means for controlling the means for temporarily affixing so as to generate a uniform force around a perimeter of the fixture to effectuate the temporarily affixing; means for aligning the mask to the substrate, the means for aligning controlling movement of the stage in the first and second directions and rotation about the axis; and means for fastening the fixture together.

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