Mask and method of manufacturing the same,...

Etching a substrate: processes – Forming or treating mask used for its nonetching function

Reexamination Certificate

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C430S005000

Reexamination Certificate

active

06893575

ABSTRACT:
A mask has a monocrystal substrate having opposite surfaces which are planes having Miller indices {110}. A plurality of penetrating holes are formed in the monocrystal substrate. An opening shape of each of the penetrating holes is a polygon and each side of the polygon is parallel with a plane in a group of the {111} planes. The wall surfaces of the penetrating holes are the {111} planes. In the method of manufacturing a mask, openings are formed in the etching resistant film corresponding to the shape of the penetrating holes and the monocrystal substrate is etched.

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U.S. Appl. No. 10/247,570, filed Sep. 20, 2000, Shinichi Yotsuya.
U.S. Appl. No. 10/247,360, filed Sep. 20, 2002, Shinichi Yotsuya.

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