Etching a substrate: processes – Forming or treating mask used for its nonetching function
Reexamination Certificate
2005-05-17
2005-05-17
Mills, Gregory (Department: 1763)
Etching a substrate: processes
Forming or treating mask used for its nonetching function
C430S005000
Reexamination Certificate
active
06893575
ABSTRACT:
A mask has a monocrystal substrate having opposite surfaces which are planes having Miller indices {110}. A plurality of penetrating holes are formed in the monocrystal substrate. An opening shape of each of the penetrating holes is a polygon and each side of the polygon is parallel with a plane in a group of the {111} planes. The wall surfaces of the penetrating holes are the {111} planes. In the method of manufacturing a mask, openings are formed in the etching resistant film corresponding to the shape of the penetrating holes and the monocrystal substrate is etched.
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U.S. Appl. No. 10/247,570, filed Sep. 20, 2000, Shinichi Yotsuya.
U.S. Appl. No. 10/247,360, filed Sep. 20, 2002, Shinichi Yotsuya.
Culbert Roberts
Mills Gregory
Oliff & Berridg,e PLC
Seiko Epson Corporation
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