Mask aligner

Details Mask aligner Mask aligner

1982-12-02

1984-10-30

Hix, L. T.

Photocopying

Projection printing and copying cameras

Identifying, composing, or selecting

355 53, G03B 2752

Patent

active

044797117

ABSTRACT:
In a mask aligner, the actual element pattern of a mask is transferred onto a resist applied to the surface of a wafer, while the alignment pattern of the mask is not transferred onto said resist. That is, the line width of the alignment pattern of the mask is a line width which is not transferred to the wafer. If the pattern of the mask is formed so that the line width of the alignment pattern is thin as compared with that of the actual element pattern, the exposure amount in the alignment pattern portion on the resist applied to the surface of the wafer becomes excessive due to the diffraction phenomenon and thus, the alignment pattern of the mask is not transferred onto the wafer.

REFERENCES:
patent: 3844655 (1974-10-01), Johannsmeier
patent: 4007988 (1977-02-01), Bromfield et al.

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