Marking on underfill

Details Marking on underfill Marking on underfill

2006-03-21

2006-03-21

Zarneke, David A. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

C257S797000, C438S127000

Reexamination Certificate

active

07015592

ABSTRACT:
A marking is formed on an underfill between a die and a substrate.

REFERENCES:
patent: 4695647 (1987-09-01), Eller et al.
patent: 5918363 (1999-07-01), George et al.
patent: 6201301 (2001-03-01), Hoang
patent: 6245595 (2001-06-01), Nguyen et al.
patent: 6365441 (2002-04-01), Raiser et al.
patent: 6614122 (2003-09-01), Dory et al.
patent: 6680220 (2004-01-01), Minamio et al.
patent: 2003/0080437 (2003-05-01), Gonzalez et al.
patent: 2003/0116864 (2003-06-01), Shi et al.
“Flip-Chip Assembly,” printed Jan. 28, 2004, http://www.semiconfareast.com/flipchipassy.htm, 3 pgs.

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