Marking method and sheet for both protective film forming...

Details Marking method and sheet for both protective film forming... Marking method and sheet for both protective film forming...

2011-05-03

2011-05-03

Lindsay, Jr., Walter L (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S464000, C257SE21599

Reexamination Certificate

active

07935574

ABSTRACT:
The invention provides a marking method in which marking is performed on a protective film formed on a work with a high accuracy while suppressing a warpage and, also, a sheet for both protective film forming and dicing which is advantageously used in the method. The marking method comprises irradiating laser light to a laminated structure comprising a support film tensely supported by a ring frame, a protective film releasably laminated on the support film and a work fixed to the protective film, wherein the protective film is irradiated laser light from a side of the support film, to thereby mark the protective film.

REFERENCES:
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patent: 2001/0042902 (2001-11-01), Wakabayashi et al.
patent: 2004/0033375 (2004-02-01), Mori
patent: 2005/0126686 (2005-06-01), Cheong et al.
patent: 2002-280329 (2002-09-01), None
patent: 2004-214288 (2004-07-01), None

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