Mark forming method, mark forming apparatus and analyzing...

Details Mark forming method, mark forming apparatus and analyzing... Mark forming method, mark forming apparatus and analyzing...

2005-03-08

2005-03-08

Cuneo, Kamand (Department: 2829)

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

C324S754090

Reexamination Certificate

active

06864675

ABSTRACT:
A mark forming apparatus including a guide needle for forming a mark, a positioning mechanism, a solution supply device, and a heating unit is disclosed. The positioning mechanism is used for positioning the guide needle above a fault location of a semiconductor device. The solution supply device supplies a solution containing a coloring agent and a volatile solvent to the fault location until it touches a tip of the guide needle. The heating unit evaporates the volatile solvent to form a mark consisting of the coloring agent surrounding the fault location.

REFERENCES:
patent: 3507389 (1970-04-01), Casner et al.
patent: 3572400 (1971-03-01), Casner et al.
patent: 4568879 (1986-02-01), Nakamura et al.
patent: 4992729 (1991-02-01), Nadeau
patent: 5474640 (1995-12-01), Ye et al.
patent: 02-122536 (1990-10-01), None

Affiliated with

Also associated with

Rating

Mark forming method, mark forming apparatus and analyzing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mark forming method, mark forming apparatus and analyzing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mark forming method, mark forming apparatus and analyzing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3404149