Manufacturing unit for semiconductor devices

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

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Details

156626, 156640, 156656, 156665, H01L 21306, B44C 122

Patent

active

052445275

ABSTRACT:
A sensor for detecting the end point of etching is secured to a wafer chuck and a light projector and light receiver of an infrared photosensor which is used as the sensor for detecting the end point for aluminum etching rotates in synchronization with the rotation of a wafer during the etching process and the end point of etching is judged by a judgement circuit which receives a signal from the sensor for detecting the etching end point. In a spin etcher for the wafer, the sensor constantly monitors the same location on the wafer and thus prevents misjudgment of the end point of etching by an unstable waveform of the end-point detection signal.

REFERENCES:
patent: 5032217 (1991-07-01), Tanaka
patent: 5069002 (1991-12-01), Sandhu et al.

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