Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1992-07-13
1993-09-14
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
156626, 156640, 156656, 156665, H01L 21306, B44C 122
Patent
active
052445275
ABSTRACT:
A sensor for detecting the end point of etching is secured to a wafer chuck and a light projector and light receiver of an infrared photosensor which is used as the sensor for detecting the end point for aluminum etching rotates in synchronization with the rotation of a wafer during the etching process and the end point of etching is judged by a judgement circuit which receives a signal from the sensor for detecting the etching end point. In a spin etcher for the wafer, the sensor constantly monitors the same location on the wafer and thus prevents misjudgment of the end point of etching by an unstable waveform of the end-point detection signal.
REFERENCES:
patent: 5032217 (1991-07-01), Tanaka
patent: 5069002 (1991-12-01), Sandhu et al.
NEC Corporation
Powell William A.
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