Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2008-01-29
2008-01-29
Lee, Calvin (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257S778000
Reexamination Certificate
active
11240859
ABSTRACT:
A system (100) for manufacturing product, in which a first work station (101) is operable to perform a first manufacturing action on the product parts; this first station has a first entrance (101a) and a first exit101b). A second work station (102) is operable to perform a second manufacturing action on the product parts; this second station has a second entrance (102a) and a second exit (102b). A transport line (103) between the first exit and the second entrance is operable to move the product parts under computer control. A chamber (104) encloses a portion of the line and is constructed so that the transport achieves a balanced throughput from the first station to the second station, while the product parts are exposed to computer-controlled environmental conditions (110) during transport through the chamber. The balanced throughput in the chamber is achieved by waiting lines for the product with computer-controlled monitors (105a) for product parts' positions and times in the chamber.
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Chiu Tz-Cheng
Odegard Charles A.
Yamunan Vinu
Brady III Wade J.
Lee Calvin
Telecky , Jr. Frederick J.
Texas Instruments Incorporated
Thach Tum
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