Manufacturing process of leadframe-based BGA packages

Details Manufacturing process of leadframe-based BGA packages Manufacturing process of leadframe-based BGA packages

2008-05-19

2010-02-16

Garber, Charles D (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S110000, C438S111000, C438S112000, C438S113000, C438S124000, C438S125000, C438S126000, C438S127000, C438S012000, C438S013000, C438S039000, C438S040000, C438S041000, C438S042000, C438S043000, C438S044000, C438S458000, C438S459000, C438S626000, C438S633000, C438S689000, C438S690000, C438S757000, C438S940000, C438S959000, C257S666000, C257S667000, C257S668000, C257S669000, C257S670000, C257S671000, C257S672000, C257S673000, C257S674000, C257S675000, C257S676000, C257S677000, C257S678000, C257SE23031, C257S

Reexamination Certificate

active

07662672

ABSTRACT:
A manufacturing process of a leadframe-based BGA package is disclosed. A leadless leadframe with an upper layer and a lower layer is provided for the package. The upper layer includes a plurality of ball pads, and the lower layer includes a plurality of sacrificial pads aligning and connecting with the ball pads. A plurality of leads are formed in either the upper layer or the lower layer to interconnect the ball pads or the sacrificial pads. An encapsulant is formed to embed the ball pads after chip attachment and electrical connections. During manufacturing process, a half-etching process is performed after encapsulation to remove the sacrificial pads to make the ball pads electrically isolated and exposed from the encapsulant for solder ball placement where the soldering areas of the ball pads are defined without the need of solder mask(s) to solve the problem of solder bleeding of the solder balls on the leads or the undesired spots during reflow. Moreover, mold flash can easily be detected and removed.

REFERENCES:
patent: 6001671 (1999-12-01), Fjelstad
patent: 6964918 (2005-11-01), Fan et al.

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