Manufacturing process for the collective production of semicondu

Details Manufacturing process for the collective production of semicondu Manufacturing process for the collective production of semicondu

1976-12-09

1978-07-04

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

29580, 29576W, B01J 1700

Patent

active

040979865

ABSTRACT:
A process intended for combining the "flip-chip bonding" technique with a method yielding diodes of very thin substrate forming mesa units or clumps etched out in a dielectric block embedding the semiconductor body. The process comprises, starting from a semiconductive wafer, a double mesa etching and a double lapping, each of them carried out on each side of the wafer, due to a thick dielectric layer and a thick metallic support respectively brought in at the right moment.

REFERENCES:
patent: 3290753 (1966-12-01), Chang
patent: 3400309 (1968-09-01), Doo
patent: 3895429 (1975-07-01), Huang
patent: 3896478 (1975-07-01), Henry

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