Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-07-31
2010-11-09
Levi, Dameon E (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S752000, C257S679000, C174S521000, C029S830000
Reexamination Certificate
active
07830666
ABSTRACT:
An MMC/SD core unit includes a PCBA in which all passive components and unpackaged IC chips are attached to a single side of a PCB opposite to the metal contacts. The IC chips include, for example, a controller chip and a flash memory chip, or a single-chip (combined controller/flash memory) chip. Multiple flash IC chips are optionally stacked to increase storage capacity. The IC chip(s) are attached to the PCB by wire bonding or other chip-on-board (COB) technique. The passive components are attached by conventional surface mount technology (SMT) techniques. A molded housing is then formed over the IC chips and passive components such that the device has a uniform thickness. The MMC/SD core unit is then inserted or otherwise mounted in an eternal casing to provide a finished MMC/SD device.
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Hiew Siew S.
Hsueh Paul
Lee Charles C.
Ni Jim C.
Shen Ming-Shiang
Bever Patrick T.
Bever Hoffman & Harms LLP
Levi Dameon E
Super Talent Electronics Inc.
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