Manufacturing process for organic chip carrier

Details Manufacturing process for organic chip carrier Manufacturing process for organic chip carrier

1995-11-16

1998-07-28

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29852, 427 97, H05K 114

Patent

active

057847819

ABSTRACT:
A manufacturing process for an organic chip carrier is disclosed which permits one to form a substantially bowl-shaped via hole in the substrate of the chip carrier, which makes it easy to deposit a conductive layer having a substantially uniform thickness on the sidewall of the via hole. In accordance with the manufacturing process, photosensitive resin 3 is provided on a substrate 1 in a thickness which is the thickness necessary for a final insulating layer plus a thickness to be removed by, for example grinding, the photosensitive resin 3. Cavities are then formed in the photosensitive resin 3 in a predetermined pattern by exposure and development. The photosensitive resin 3 formed with the cavities 8 is heat-cured. Subsequently, when the photo-cured layer 6a and a part of the heat-cured layer 3a are removed, e.g., ground off, a substantially bowl-shaped via hole 9 is formed.

REFERENCES:
patent: 5092032 (1992-03-01), Murakami
patent: 5224264 (1993-07-01), Takahashi et al.
patent: 5284725 (1994-02-01), Takatsu
patent: 5308929 (1994-05-01), Tani et al.
patent: 5562970 (1996-10-01), Satoh

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