Manufacturing process for obtaining integrated structure bipolar

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Radiation or energy treatment modifying properties of...

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438904, 438356, H01L 21265

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active

056248520

ABSTRACT:
Integrated structure bipolar transistors with controlled storage time are manufactured by forming at least one bipolar transistor occupying a first area on a first surface of the silicon material, covering the first surface of the silicon material with an insulating material layer, and selectively removing the insulating material layer to open a window. The window has a second area much smaller than the first area occupied by the bipolar transistor. Therefore, by implanting into the silicon material a medium dose of platinum ions through the window and diffusing into the silicon material the implanted platinum ions, a uniform distribution of platinum inside the transistor is obtained.

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Ion Implantation Technology. Ninth International Conference, Gainesville, FL, USA, 20-24 Sep. 1992, ISSN 0169-483X, Nuclear Instruments & Methods in Physics Research, Section B (Beam Interactions with Materials and Atoms), Apr. 1993, Netherlands, pp. 47-52, Coffa S. et al. "Diffusion and Lifetime Engineering Silicon".

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