Etching a substrate: processes – Forming or treating thermal ink jet article
Patent
1997-11-18
2000-12-12
Gulakowski, Randy
Etching a substrate: processes
Forming or treating thermal ink jet article
347 63, B41J 205, G01D 1518
Patent
active
061593877
ABSTRACT:
A manufacturing process and a structure for an ink jet printhead with high quality, yield rate, and performance are provided. The process includes steps of: a) providing a substrate, b) forming a dielectric layer over the substrate, c) forming a resistor over the dielectric layer, d) forming a conducting layer over a portion of the resistor, e) forming a passivation over a portion of the conducting layer and another portion of the resistor not covered by the conducting layer, f) forming a hole over the passivation for storing an ink, and g) forming a nozzle over the hole for ejecting therethrough the ink.
REFERENCES:
patent: 4206541 (1980-06-01), Marciniec
patent: 5122812 (1992-06-01), Hess et al.
Chang Yee-Shyi
Chang Ying-Lun
Cheng Shiang-Ching
Chou Chin-Yi
Mou Tse-Chi
Ahmed Shamim
Gulakowski Randy
Microjet Technology Co., Inc.
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