Manufacturing miniature hearing aid having a multi-layer circuit

Electrical audio signal processing systems and devices – Sound effects – Reverberators

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29852, 156634, 156645, 156656, 156630, 156902, 174 685, 361398, 361399, 381 687, 381 69, 427 96, H04R 2500, H05K 100, B44C 122, C23F 102

Patent

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047838159

ABSTRACT:
As opposed to standard circuit board fabrication techniques, whereby plated holes are commonly bored through all the layers of a multilayer board, the circuit board for a hearing aid according to the invention is fabricated by alternatingly forming plated holes in subpackets of the circuit board and then joining together the subpackets until the completed multilayer board is bonded together. The circuit board can be provided with plated internal holes, plated blind holes as well as standard through holes. An especially high component density on the two surfaces of the circuit board is acheived, as well as the fabrication of extremely thin and flexible multilayer circuit boards.

REFERENCES:
patent: 3219749 (1965-11-01), Schuster et al.
patent: 3436819 (1969-04-01), Lunine
patent: 3471348 (1969-10-01), Shaheen et al.
patent: 3471631 (1969-10-01), Quintana
patent: 4037047 (1977-07-01), Taylor
patent: 4663208 (1987-05-01), Ninomiya et al.
patent: 4710419 (1987-12-01), Gregory

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