Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-03-27
2010-11-30
Trinh, Minh (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S600000, C029S592100, C343S7000MS, C343S895000, C257S700000
Reexamination Certificate
active
07841076
ABSTRACT:
A multilayer wiring structural body13is formed on a surface57A of a metal plate57used as a support plate in the case of forming the multilayer wiring structural body13, and the metal plate57is patterned and a slot antenna60is formed.
REFERENCES:
patent: 4864314 (1989-09-01), Bond
patent: 5748152 (1998-05-01), Glabe et al.
patent: 6166705 (2000-12-01), Mast et al.
patent: 6281843 (2001-08-01), Evtioushkine et al.
patent: 6421013 (2002-07-01), Chung
patent: 6549172 (2003-04-01), Thevenot et al.
patent: 6591494 (2003-07-01), Okamura et al.
patent: 6801165 (2004-10-01), Fang
patent: 6988312 (2006-01-01), Nakamura et al.
patent: 7098854 (2006-08-01), Herrick
patent: 7248133 (2007-07-01), Koga et al.
patent: 2004/0074088 (2004-04-01), Nakamura et al.
patent: 2005/0155222 (2005-07-01), Nakamura
patent: 2000-91717 (2000-03-01), None
Drinker Biddle & Reath LLP
Shinko Electric Industries Co. Ltd.
Trinh Minh
LandOfFree
Manufacturing method of wiring substrate and manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Manufacturing method of wiring substrate and manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method of wiring substrate and manufacturing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4191375