Manufacturing method of wiring substrate

Details Manufacturing method of wiring substrate Manufacturing method of wiring substrate

2007-07-24

2007-07-24

Clark, S. V. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S654000

Reexamination Certificate

active

11169007

ABSTRACT:
After a first adhesive layer having high adhesion to a supporting base is locally formed, a second adhesive layer having low adhesion to the supporting base is formed all over the supporting base so as to cover the first adhesive layer. When a wiring structure is separated, a predetermined portion of the wiring structure where the first adhesive layer is formed is cut to thereby separate the integrated wiring structure and second adhesive layer from the first adhesive layer.

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