Manufacturing method of wiring board

Details Manufacturing method of wiring board Manufacturing method of wiring board

2008-11-28

2011-11-29

Van, Luan (Department: 1724)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

Reexamination Certificate

active

08066862

ABSTRACT:
A manufacturing method of a wiring board includes a sticking layer forming step; a resist film forming step of forming a resist film on an upper surface of the sticking layer, the resist film having an opening exposing the upper surface of the sticking layer; a metal layer forming step of forming a metal layer, so as to cover an upper surface of the resist film and cover a side surface of the resist film and the upper surface of the sticking layer forming the opening for forming the wiring; a plating film forming step of filling with a plating film the opening for forming the wiring; a metal layer and plating film removing step; a resist film removing step; and a sticking layer removing step of removing the sticking layer of an unnecessary part not covered with the metal layer, after the resist film removing step.

REFERENCES:
patent: 6642136 (2003-11-01), Lee et al.
patent: 7012019 (2006-03-01), Hsu et al.
patent: 7199036 (2007-04-01), Chan et al.
patent: 2002/0177006 (2002-11-01), Clothier et al.
patent: 2006/0022304 (2006-02-01), Rzeznik
patent: 2006/0202331 (2006-09-01), Hu
patent: 2007/0158199 (2007-07-01), Haight et al.
patent: 10-125818 (1998-05-01), None

Affiliated with

Also associated with

Rating

Manufacturing method of wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacturing method of wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method of wiring board will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4275779