Manufacturing method of wiring and storage element

Details Manufacturing method of wiring and storage element Manufacturing method of wiring and storage element

2008-02-27

2011-12-13

Talbot, Brian K (Department: 1715)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S098200, C427S558000

Reexamination Certificate

active

08075945

ABSTRACT:
In a coating method, such as a droplet discharge method which requires baking, it is an object of the present invention to reduce the baking temperature at the time of forming a wiring and a conductive film. As a feature of the present invention, a composition, in which nanoparticles of a conductive material are dispersed in a solvent, is discharged using a droplet discharge method, and then dried to vaporize the solvent. Then, pretreatment using active oxygen is performed. After which, baking is then performed, whereby a wiring and a conductive film are formed. By performance of the pretreatment by active oxygen before the baking, a baking temperature at the time of forming the wiring and conductive film can be reduced.

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