Manufacturing method of transparent substrate for mask...

Details Manufacturing method of transparent substrate for mask... Manufacturing method of transparent substrate for mask...

2010-11-23

2011-10-18

Huff, Mark F (Department: 1721)

Radiation imagery chemistry: process, composition, or product th

Radiation modifying product or process of making

Radiation mask

C204S192120

Reexamination Certificate

active

08039178

ABSTRACT:
There are provided a manufacturing method of a transparent substrate for a mask blank, a mask blank, or an exposure mask adapted to prevent occurrence of a transfer pattern defect or a mask pattern defect, by correcting a recessed defect existing on the surface of the transparent substrate, and a defect correction method of an exposure mask.With respect to an exposure mask having a transparent substrate1formed thereon with a mask pattern2which becomes a transfer pattern, correction is performed by removing, by the use of a needle-shaped member4, a peripheral portion of a recessed defect3formed on a surface1aof the substrate, where the mask pattern2is not formed, so as to induce a reduction in transmission light quantity which causes a transfer pattern defect, thereby reducing a level difference between the surface of the substrate and the depth of the recessed defect. This correction of the recessed defect is carried out at the stage before forming a mask pattern forming thin film on the transparent substrate. A mask blank and an exposure mask are manufactured by the use of the transparent substrate applied with the correction of the recessed defect.

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Japanese Office Action corresponding to Japanese Patent Application No. 2005-181456, dated Jun. 8, 2010.
Korean Office Action, mailed Jul. 4, 2009.

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