Manufacturing method of the embedded passive device

Details Manufacturing method of the embedded passive device Manufacturing method of the embedded passive device

2008-12-06

2011-11-08

Phan, Thiem (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S829000, C029S831000

Reexamination Certificate

active

08051558

ABSTRACT:
A manufacturing method for mainly embedding the passive device structure in the printed circuit board is presented. In this structure, both the source electrode and the ground electrode of the passive device belong to the same level, and includes several source branches and several ground branches that are formed vertically on the inside of the dielectric layer of the circuit board which are connected, respectively, to avoid the conducting between the source electrode and the ground electrode during lamination. When it is in the form of the capacitor structure, through the use of the ultra-fine wiring technique, these source branches and ground branches are separated by a small gap between each other. Therefore, the side face area and quantities of the source branches and ground branches are both increased.

REFERENCES:
patent: 5459633 (1995-10-01), Kosslowski et al.
patent: 7195971 (2007-03-01), Bernstein et al.

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