Manufacturing method of substrate for ink jet head and...

Details Manufacturing method of substrate for ink jet head and... Manufacturing method of substrate for ink jet head and...

2007-03-02

2010-06-01

Ahmed, Shamim (Department: 1792)

Etching a substrate: processes

Forming or treating thermal ink jet article

C216S017000, C216S094000, C216S096000, C438S021000, C438S706000, C438S719000, C438S745000, C438S753000, C029S890100, C219S121600, C219S121690

Reexamination Certificate

active

07727411

ABSTRACT:
The present invention provides a manufacturing method of a substrate for an ink jet head including forming an ink supply opening to a silicon substrate, including (a) forming, at the back surface of the silicon substrate, an etching mask layer, which has an opening that is asymmetric with a center line, extending in the longitudinal direction, of an area on the surface of the silicon substrate where the ink supply opening is to be formed; (b) forming a non-through hole on the silicon substrate via the opening on the etching mask layer; and (c) forming the ink supply opening by performing a crystal anisotropic etching to the silicon substrate from the opening.

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