Manufacturing method of solid-state image sensing device

Details Manufacturing method of solid-state image sensing device Manufacturing method of solid-state image sensing device

2007-01-30

2007-01-30

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S834000, C029S855000, C029S592100, C438S106000, C438S124000, C257S291000

Reexamination Certificate

active

10659433

ABSTRACT:
In a method of manufacturing a camera module having a CMOS image sensor, a semiconductor chip to serve as a light sensor is mounted on a optical-component-mounting face of a wiring substrate mother board and, after bonding wires are connected to the semiconductor chip, a lens barrel is joined to the wiring substrate mother board so as to cover the semiconductor chip. A position adjustment pin and a through hole are provided on the lens barrel and the wiring substrate mother board respectively outside a junction face between the lens barrel and the wiring substrate mother board to be used for adjusting the position of the lens barrel with respect to the wiring substrate mother board by inserting the position adjustment pin into the through hole.

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