Manufacturing method of solid-state image pickup device

Details Manufacturing method of solid-state image pickup device Manufacturing method of solid-state image pickup device

2009-12-30

2011-10-11

Ward, Jessica L (Department: 1735)

Metal fusion bonding

Process

Plural joints

C438S612000, C438S613000, C257S737000, C257S738000, C257S778000, C257S779000, C257S780000

Reexamination Certificate

active

08033446

ABSTRACT:
After a wiring substrate having, on its lower surface, an opening and terminals arranged therearound is provided, a sealing material is supplied to the lower surface of the wiring substrate, and a sensor chip is flip-chip mounted on the lower surface of the wiring substrate. The sensor chip has, on its front surface, a sensor surface and bump electrodes, and each bump electrode is thermocompression-bonded onto each terminal of the wiring substrate and the sensor surface is exposed from the opening. The sensor chip has, in its outer peripheral portion of the front surface, a first region where the bump electrodes are arranged and a second region where no bump electrode is arranged. The sealing material is supplied to a region planarly overlapped with the first region when the sensor chip is mounted later, and no sealing material is supplied to a region planarly overlapped with the second region.

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