Semiconductor device manufacturing: process – Semiconductor substrate dicing
Reexamination Certificate
2006-09-27
2011-11-29
Ridley, Basia (Department: 1725)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
C438S057000, C438S066000, C438S067000, C438S068000, C438S098000, C438S458000, C438S461000, C438S129000, C136S244000, C136S252000, C136S256000
Reexamination Certificate
active
08067295
ABSTRACT:
A double-side light receiving solar cell in a planer regular hexagon shape and having first electrodes on both surfaces are divided into four pieces by a line A-A′ connecting two opposing apexes and by a line B-B′ perpendicular to the line A-A′ and connecting center points on two opposing sides. By matching oblique lines of two divided pieces without misalignment and with respective surfaces in an inversed state, the first electrodes on the same side of the two divided pieces align along the same single straight line. Then, the first electrodes that are on the same side are connected with a first inter connecter, thereby constructing a unit having a rectangular outline. Units thus constructed are arranged so that relevant sides match without misalignment. By handling on a unit basis as described above, it is possible to facilitate an arrangement of the cells and an electricity connection work.
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Nakauchi Atsushi
Okamoto Shingo
Yagiura Toshio
Bernier Lindsey
Ridley Basia
SANYO Electric Co., Ltd
Westerman Hattori Daniels & Adrian LLP
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