Semiconductor device manufacturing: process – Forming schottky junction – Compound semiconductor
Patent
1995-06-02
1998-08-04
Niebling, John
Semiconductor device manufacturing: process
Forming schottky junction
Compound semiconductor
438571, H01L 2128
Patent
active
057893110
ABSTRACT:
A Schottky electrode is formed on an n-type SiC base member with an Al--Ti alloy or by laying Al films and Ti films alternately, and a resulting structure is subjected to a heat treatment of 600.degree. C. to 1,200.degree. C. A p-type SiC layer may be formed around the Schottky junction so as to form a p-n junction with the n-type SiC base member.
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Hashimoto Koichi
Ogino Shinji
Seki Yasukazu
Ueno Katsunori
Urushidani Tatsuo
Fuji Electric & Co., Ltd.
Mulpuri S.
Niebling John
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