Manufacturing method of semiconductor wafer having lid part...

Details Manufacturing method of semiconductor wafer having lid part... Manufacturing method of semiconductor wafer having lid part...

2007-06-12

2007-06-12

Hoang, Quoc (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S125000, C257S704000, C257SE21500

Reexamination Certificate

active

11152950

ABSTRACT:
An adhesive layer containing a photo-curing adhesive and a thermosetting adhesive is formed on a semiconductor wafer in which a plurality of semiconductor elements are formed. The adhesive layer and the semiconductor wafer are adhered together by selectively exposing the adhesive layer to light and curing the photo-curing adhesive contained in the adhesive layer on the peripheral portion of each semiconductor element. By developing the photo-curing adhesive, the adhesive layer in an area that has not been exposed is removed. Whether the pattern of the adhesive layer is satisfactory or not is determined for each semiconductor element. A lid part is placed on the adhesive layer of the semiconductor element determined to be satisfactory, and the adhesive layer and the lid part are adhered together by heating the adhesive layer and causing the thermosetting adhesive contained in the adhesive layer to exhibit adhesive properties.

REFERENCES:
patent: 2004/0232833 (2004-11-01), Menda et al.
patent: 2006/0043544 (2006-03-01), Tsukamoto et al.
patent: 2001-257334 (2001-09-01), None
patent: 2004-296453 (2004-10-01), None

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