Optics: measuring and testing – Inspection of flaws or impurities – Surface condition
Reexamination Certificate
2006-06-13
2006-06-13
Pham, Hoa Q. (Department: 2877)
Optics: measuring and testing
Inspection of flaws or impurities
Surface condition
C356S237500
Reexamination Certificate
active
07061600
ABSTRACT:
A pattern detection method and apparatus for inspecting, with high resolution, a micro fine defect of a pattern on an inspected object, and a semiconductor substrate manufacturing method and system with a high yield. A micro fine pattern on the inspected object is inspected by annular-looped illumination through an objective lens onto a wafer, the wafer having micro fine patterns thereon. The illumination may be polarized and controlled according to an image detected on the pupil of the objective lens, and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect. Simultaneously, micro fine defects on the micro-fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect.
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Kubota Hitoshi
Maeda Shunji
Nakayama Yasuhiko
Oka Kenji
Yoshida Minoru
Antonelli, Terry Stout and Kraus, LLP.
Pham Hoa Q.
Renesas Technology Corp.
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