Manufacturing method of semiconductor substrate and method...

Optics: measuring and testing – Inspection of flaws or impurities – Surface condition

Reexamination Certificate

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C356S237500

Reexamination Certificate

active

07061600

ABSTRACT:
A pattern detection method and apparatus for inspecting, with high resolution, a micro fine defect of a pattern on an inspected object, and a semiconductor substrate manufacturing method and system with a high yield. A micro fine pattern on the inspected object is inspected by annular-looped illumination through an objective lens onto a wafer, the wafer having micro fine patterns thereon. The illumination may be polarized and controlled according to an image detected on the pupil of the objective lens, and image signals are obtained by detecting a reflected light from the wafer. The image signals are compared with reference image signals and a part of the pattern showing inconsistency is detected as a defect. Simultaneously, micro fine defects on the micro-fine pattern are detected with high resolution. Further, process conditions of a manufacturing line are controlled by analyzing a cause of defect and a factor of defect.

REFERENCES:
patent: 4299443 (1981-11-01), Minami et al.
patent: 4725722 (1988-02-01), Maeda et al.
patent: 4877326 (1989-10-01), Chadwick et al.
patent: 4999014 (1991-03-01), Gold et al.
patent: 5085517 (1992-02-01), Chadwick et al.
patent: 5098191 (1992-03-01), Noguchi et al.
patent: 5131755 (1992-07-01), Chadwick et al.
patent: 5355212 (1994-10-01), Wells et al.
patent: 5377002 (1994-12-01), Malin et al.
patent: 5479252 (1995-12-01), Worster et al.
patent: 5699447 (1997-12-01), Alumot et al.
patent: 5719405 (1998-02-01), Hayano
patent: 5897710 (1999-04-01), Sato et al.
patent: 5963314 (1999-10-01), Worster et al.
patent: 6781688 (2004-08-01), Kren et al.
patent: 3-153054 (1991-07-01), None
patent: 4-311053 (1992-11-01), None
patent: 5-006928 (1993-01-01), None
patent: 6-194402 (1994-07-01), None
patent: 6-275696 (1994-09-01), None

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