Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Agitating or moving electrolyte during coating
Reexamination Certificate
2008-10-23
2011-10-04
Richards, N Drew (Department: 2895)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Agitating or moving electrolyte during coating
C205S137000, C205S143000, C205S145000, C205S157000, C204S212000, C204S213000, C204S214000, C204S273000
Reexamination Certificate
active
08029660
ABSTRACT:
Manufacture of semiconductor products such as LCD driver requires a bump plating step for forming a gold bump electrode having a size of from about 15 to 20 μm. This bump plating step is performed by electroplating with a predetermined plating solution, but projections intermittently appear on the bump electrode during a mass production process. In the invention, abnormal growth of projections over the gold bump electrode is prevented by adding, prior to the gold bump plating step, a step of circulating and stirring a plating solution while erecting a plating cup and efficiently dissolving/discharging a precipitate. This step is performed for each wafer to be treated.
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Kanaoka Taku
Maitani Tota
Dulka John P
Miles & Stockbridge P.C.
Renesas Electronics Corporation
Richards N Drew
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