Manufacturing method of semiconductor integrated circuit device

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

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Details

C700S051000, C700S121000, C702S183000, C707S793000

Reexamination Certificate

active

07346412

ABSTRACT:
The invention intends to provide a manufacturing method of a semiconductor integrated circuit device, which can detect an off-specification faulty wafer in real time. An abnormality detection server stores apparatus log data outputted from semiconductor manufacturing apparatus that processes a semiconductor wafer in an apparatus log data memory. Thereafter, in a lot end signal receiver, when a lot end signal outputted from the semiconductor manufacturing apparatus is received, an abnormal data detector, after referencing an abnormality detection condition setting file stored in a first detection condition memory, based on the referenced content, judges whether there are abnormal data in the apparatus log data stored in the apparatus log data memory or not. Upon detecting an abnormality, a detection result is outputted to an engineer PC and an operator terminal unit.

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International Search Report, for Application No. PCT/JP2004/015835, mailed Dec. 14, 2004.
Chinese Official Action dated Jul. 27, 2007, for Application No. 200480033020.3.

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