Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate
2007-09-18
2007-09-18
Le, Thao P. (Department: 2818)
Semiconductor device manufacturing: process
With measuring or testing
C257S048000
Reexamination Certificate
active
11100600
ABSTRACT:
Electrical testing is to be performed on a semiconductor integrated circuit device which the test pads formed. To facilitate such testing, the method of manufacture of the semiconductor integrated circuit device employs a probe card which has two or more contact terminals which can contact two or more electrodes. This probe card includes, in opposition to a wiring substrate of the semiconductor integrated circuit device in which a first wiring is formed, a first sheet having two or more contact terminals to contact the two or more electrodes; a second wiring electrically connected to the two or more contact terminals and the first wiring; and first dummy wirings which are near the region of formation of the two or more contact terminals, are arranged to a non-forming region of the second wiring, and do not participate in signal transfer.
REFERENCES:
patent: 2002/0106820 (2002-08-01), Nikawa
patent: 2004/0238818 (2004-12-01), Kim
patent: 05-283490 (1993-10-01), None
patent: 2001-108706 (2001-04-01), None
patent: 2002-014137 (2002-01-01), None
patent: 2002-228682 (2002-08-01), None
Hasebe Akio
Matsumoto Hideyuki
Motoyama Yasuhiro
Okamoto Masayoshi
Shimase Akira
Antonelli, Terry Stout & Kraus, LLP.
Le Thao P.
Renesas Technology Corp.
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